Memristive devices by ALD: design aspects for high density 3D arrays for memory and neuromorphic applications

Boris Hudec; Che-Chia Chang; Tuo-Hung Hou

doi:10.1109/ICSICT.2018.8564975

Memristive devices by ALD: design aspects for high density 3D arrays for memory and neuromorphic applications

Boris Hudec^*, Che-Chia Chang, Tuo-Hung Hou

^*此作品的通信作者

電機工程學系

研究成果: Conference contribution › 同行評審

原文	English
主出版物標題	2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT)
編輯	YL Jiang, TA Tang, F Ye
發行者	IEEE
章節	S36-3
頁面	863-863
頁數	1
DOIs	https://doi.org/10.1109/ICSICT.2018.8564975
出版狀態	Published - 31 10月 2018
事件	14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Qingdao 持續時間: 31 10月 2018 → 3 11月 2018

Conference

Conference	14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)
城市	Qingdao
期間	31/10/18 → 3/11/18

存取文件

10.1109/ICSICT.2018.8564975

引用此

Hudec, B., Chang, C-C., & Hou, T-H. (2018). Memristive devices by ALD: design aspects for high density 3D arrays for memory and neuromorphic applications. 於 YL. Jiang, TA. Tang, & F. Ye (編輯), 2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT) (頁 863-863). [8564975] IEEE. https://doi.org/10.1109/ICSICT.2018.8564975

@inproceedings{e8a2de9c74c24980a3b5e63d773647cf,

title = "Memristive devices by ALD: design aspects for high density 3D arrays for memory and neuromorphic applications",

author = "Boris Hudec and Che-Chia Chang and Tuo-Hung Hou",

year = "2018",

month = oct,

day = "31",

doi = "10.1109/ICSICT.2018.8564975",

language = "English",

pages = "863--863",

editor = "YL Jiang and TA Tang and F Ye",

booktitle = "2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT)",

publisher = "IEEE",

note = "null ; Conference date: 31-10-2018 Through 03-11-2018",

}

Hudec, B, Chang, C-C & Hou, T-H 2018, Memristive devices by ALD: design aspects for high density 3D arrays for memory and neuromorphic applications. 於 YL Jiang, TA Tang & F Ye (編輯), 2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT)., 8564975, IEEE, 頁 863-863, 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Qingdao, 31/10/18. https://doi.org/10.1109/ICSICT.2018.8564975

Memristive devices by ALD : design aspects for high density 3D arrays for memory and neuromorphic applications. / Hudec, Boris; Chang, Che-Chia; Hou, Tuo-Hung.

2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT). 編輯 / YL Jiang; TA Tang; F Ye. IEEE, 2018. p. 863-863 8564975.

研究成果: Conference contribution › 同行評審

TY - GEN

T1 - Memristive devices by ALD

AU - Hudec, Boris

AU - Chang, Che-Chia

AU - Hou, Tuo-Hung

PY - 2018/10/31

Y1 - 2018/10/31

U2 - 10.1109/ICSICT.2018.8564975

DO - 10.1109/ICSICT.2018.8564975

M3 - Conference contribution

SP - 863

EP - 863

BT - 2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT)

A2 - Jiang, YL

A2 - Tang, TA

A2 - Ye, F

PB - IEEE

Y2 - 31 October 2018 through 3 November 2018

ER -