Mean-time-to-crack model of microbump interconnect in FCGBA package under thermal cyclic test

Chien Chang Chen*, Wei Chen Wu, Ching Yu Chin, Hung-Ming Chen, Vito Lin, Eason Chen

*此作品的通信作者

研究成果同行評審

摘要

By employing the physical characteristics of creep deformation mechanisms for solder joints in a flip-chip ball grid array (FCBGA) package under a thermal cyclic condition, an analytical model for the prediction of mean-time-to-crack (MTTC) is presented in the paper. With the consideration of time-dependent thermal testing functionals, the basic co-analyses of one-cycle Nabarro-Herring and Coble creep rates and the corresponding damage accumulation functionals for the conventional eutectic Sn/Pb micro-solder material are studied using the proposed MTTC model theoretically. For experimentally validation of the MTTC model, a batch of devices filled with resin in FCGBA package had been tested under a -40°C∼125°C thermal cyclic test with a period of 1-hour 1000 times. The MTTC model reveals that the solder bumps within the FCGBA can survive about 0.53 year under the cyclic testing circumstance. Under the room temperature, the device even can survive about 2.45 years under continuously operations.

原文English
頁面104-109
頁數6
DOIs
出版狀態Published - 2013
事件19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013 - Berlin, 德國
持續時間: 25 9月 201327 9月 2013

Conference

Conference19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013
國家/地區德國
城市Berlin
期間25/09/1327/09/13

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