Mathematical yield estimation for two-dimensional-redundancy memory arrays

Chia-Tso Chao, Ching Yu Chin, Chen Wei Lin

    研究成果: Conference contribution同行評審

    3 引文 斯高帕斯(Scopus)

    摘要

    Defect repair has become a necessary process to enhance the overall yield for memories since manufacturing a natural good memory is difficult in current memory technologies. This paper presents an yield-estimation scheme, which utilizes an inductionbased approach to calculate the probability that all defects in a memory can be successfully repaired by a two-dimensional redundancy design. Unlike previous works, which rely on a timeconsuming simulation to estimate the expected yield, our yieldestimation scheme only requires scalable mathematical computation and can achieve a high accuracy with limited time and space complexity. Also, the proposed estimation scheme can consider the impact of single defects, column defects, and row defects simultaneously. With the help of the proposed yield-estimation scheme, we can effectively identify the most profitable redundancy configuration for large memory designs within few seconds while it may take several hours or even days by using conventional simulation approach.

    原文English
    主出版物標題2010 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2010
    發行者Institute of Electrical and Electronics Engineers Inc.
    頁面235-240
    頁數6
    ISBN(列印)9781424481927
    DOIs
    出版狀態Published - 2010
    事件2010 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2010 - San Jose, CA, United States
    持續時間: 7 11月 201011 11月 2010

    出版系列

    名字IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
    ISSN(列印)1092-3152

    Conference

    Conference2010 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2010
    國家/地區United States
    城市San Jose, CA
    期間7/11/1011/11/10

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