Materials challenges in three-dimensional integrated circuits

Keyphrases

• 3D IC 100%
• Big Data Era 20%
• Chip Packaging 20%
• Chip Technology 20%
• Computing Devices 20%
• Electronic Devices 20%
• High Cost 20%
• IC Device 20%
• Internet Infrastructure 20%
• Internet of Things 20%
• Material Selection 20%
• Materials Challenges 100%
• Materials Integration 20%
• Moore's Law 20%
• Packaging Technology 20%
• Reliability Cost 20%
• Technology Technology 20%
• Two Dimensional 20%

Material Science

• Electronic Circuit 100%
• Material Selection 25%