Materials challenges in three-dimensional integrated circuits

Keyphrases

• 3D IC 100%
• High Cost 20%
• Two Dimensional 20%
• Internet of Things 20%
• Big Data Era 20%
• Material Selection 20%
• Electronic Devices 20%
• Materials Integration 20%
• Reliability Cost 20%
• Packaging Technology 20%
• Computing Devices 20%
• Moore's Law 20%
• Internet Infrastructure 20%
• Chip Packaging 20%
• Chip Technology 20%
• IC Devices 20%

Engineering

• Three Dimensional Integrated Circuits 100%
• Two Dimensional 25%
• Computing Device 25%
• Moore's Law 25%
• Big Data 25%
• Internet-Of-Things 25%

Material Science

• Electronic Circuit 100%
• Material Selection 25%