TY - JOUR
T1 - LUTSim
T2 - A Look-Up Table-Based Thermal Simulator for 3-D ICs
AU - Lee, Yu-Min
AU - Pan, Chi Wen
AU - Huang, Pei Yu
AU - Yang, Chi Ping
PY - 2015/8/1
Y1 - 2015/8/1
N2 - To sustain Moore's law, three-dimensional integrated circuit (3-D IC) is a promising solution to achieve high performance and low cost targets. However, its operating temperature is higher than that of a 2-D IC because of its high power density of stacked dies and ill of heat dissipation capability. Therefore, on-chip thermal effects have become major concerns of 3-D ICs. Utilizing look-up table approach, this paper, LUTSim, provides two thermal simulation engines, I-LUTSim and S-LUTSim, to efficiently calculate the thermal profile of a 3-D IC. I-LUTSim is suitable for full-chip thermal analysis, and S-LUTSim is suited for incremental-thermal updating. With utilizing the prebuilt tables, compared with a commercial tool ANSYS, the absolute error of I-LUTSim is less than 0.29%. Moreover, with negligible loss of accuracy, I-LUTSim can be 38.8 times faster than a well-known matrix solver SuperLU for performing full-chip thermal simulation. Besides, S-LUTSim can be over 1.05 million times faster than SuperLU for adjusting the thermal profile after inserting/removing a through silicon via.
AB - To sustain Moore's law, three-dimensional integrated circuit (3-D IC) is a promising solution to achieve high performance and low cost targets. However, its operating temperature is higher than that of a 2-D IC because of its high power density of stacked dies and ill of heat dissipation capability. Therefore, on-chip thermal effects have become major concerns of 3-D ICs. Utilizing look-up table approach, this paper, LUTSim, provides two thermal simulation engines, I-LUTSim and S-LUTSim, to efficiently calculate the thermal profile of a 3-D IC. I-LUTSim is suitable for full-chip thermal analysis, and S-LUTSim is suited for incremental-thermal updating. With utilizing the prebuilt tables, compared with a commercial tool ANSYS, the absolute error of I-LUTSim is less than 0.29%. Moreover, with negligible loss of accuracy, I-LUTSim can be 38.8 times faster than a well-known matrix solver SuperLU for performing full-chip thermal simulation. Besides, S-LUTSim can be over 1.05 million times faster than SuperLU for adjusting the thermal profile after inserting/removing a through silicon via.
KW - Look-up table
KW - thermal simulator
KW - three-dimensional integrated circuit (3-D IC)
UR - http://www.scopus.com/inward/record.url?scp=84938355664&partnerID=8YFLogxK
U2 - 10.1109/TCAD.2015.2401578
DO - 10.1109/TCAD.2015.2401578
M3 - Article
AN - SCOPUS:84938355664
SN - 0278-0070
VL - 34
SP - 1250
EP - 1263
JO - IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
JF - IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
IS - 8
M1 - 7036103
ER -