Low Thermal Budget Cu/SiO2Hybrid Bonding Using Highly <111>-oriented Nano-twinned Cu with Low Contact Resistivity and High Bonding Strength

Jia Juen Ong, Dinh Phuc Tran, Yu Min Hsun, Wei Lan Chiu, Ou Hsiang Lee, Hsiang Hung Chang, Chih Chen*

*此作品的通信作者

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

Fine-pitch hybrid bonding with 1.25 μ m thick PECVD SiO2 as dielectric layer and highly < 111 > -oriented nano-twinned Cu as metal layer was fabricated in 12 -inch Si wafer. The dishing between the Cu and SiO2 layer could be precisely controlled within 3 nm while the surface roughness of Cu via can be obtained within 2 nm. Prior to the bonding, the wafers were treated by a 20-W ex-situ Ar plasma for 120 s. Thus, their hydrophilicity could be increased. The relationship between surface contact angle and plasma power was also investigated. We found that the 20-W Ar-plasma was the optimized parameter to effectively remove the oxide layer and obtain the lowest hydrophilicity of the nt-Cu and SiO2. The electrical properties of Kelvin structure and daisy chains with 2500 and 50 bumps were also studied using a 4-point probe method. Results showed that a contact resistivity of 10-9 Ω-cm2 was obtained. This is the lowest value found in literature as bonded at a temperature below 300°C. Die shear tests were subsequently executed. Results showed that the bonding strength exceeded 30 MPa, which was greater compared to those in some recent studies. Additionally, three-dimensional (3D) X-ray, dual beam focused ion beam (FIB-SEM) and transmission electron microscope (TEM) were also employed to examine lattice arrangement of the bonding interface. Results show excellent bonding quality and no CuOx signal found at the interface.

原文English
主出版物標題Proceedings - 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022
發行者IEEE Computer Society
ISBN(電子)9781665452212
DOIs
出版狀態Published - 2022
事件17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022 - Taipei, Taiwan
持續時間: 26 10月 202228 10月 2022

出版系列

名字Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
2022-October
ISSN(列印)2150-5934
ISSN(電子)2150-5942

Conference

Conference17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022
國家/地區Taiwan
城市Taipei
期間26/10/2228/10/22

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