Low-temperature direct copper-to-copper bonding enabled by creep on highly (1 1 1)-oriented Cu surfaces

Chien Min Liu; Han Wen Lin; Yi Cheng Chu; Chih Chen; Dian Rong Lyu; Kuan-Neng Chen; King-Ning Tu

doi:10.1016/j.scriptamat.2014.01.040

Low-temperature direct copper-to-copper bonding enabled by creep on highly (1 1 1)-oriented Cu surfaces

Chien Min Liu
, Han Wen Lin
, Yi Cheng Chu
, Chih Chen^*
, Dian Rong Lyu
, Kuan-Neng Chen
, King-Ning Tu

^*此作品的通信作者

研究成果: Article › 同行評審

116 引文斯高帕斯（Scopus）

摘要

We achieve low-temperature Cu-to-Cu direct bonding using highly (1 1 1)-orientated Cu films. The bonding temperature can be lowered to 200 C at a stress of 114 psi for 30 min at 10^-3 torr. The temperature is lower than the reflow temperature of 250 C for Pb-free solders. Our breakthrough is based on the finding that the Cu (1 1 1) surface diffusivity is the fastest among all the planes of Cu and the bonding process can occur through surface diffusion creep on the (1 1 1) surfaces.

原文	English
頁（從 - 到）	65-68
頁數	4
期刊	Scripta Materialia
卷	78-79
DOIs	https://doi.org/10.1016/j.scriptamat.2014.01.040
出版狀態	Published - 5月 2014

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10.1016/j.scriptamat.2014.01.040

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title = "Low-temperature direct copper-to-copper bonding enabled by creep on highly (1 1 1)-oriented Cu surfaces",

abstract = "We achieve low-temperature Cu-to-Cu direct bonding using highly (1 1 1)-orientated Cu films. The bonding temperature can be lowered to 200 C at a stress of 114 psi for 30 min at 10-3 torr. The temperature is lower than the reflow temperature of 250 C for Pb-free solders. Our breakthrough is based on the finding that the Cu (1 1 1) surface diffusivity is the fastest among all the planes of Cu and the bonding process can occur through surface diffusion creep on the (1 1 1) surfaces.",

keywords = "Creep, Cu-to-Cu direct bonding, Diffusion, Preferred orientation",

author = "Liu, \{Chien Min\} and Lin, \{Han Wen\} and Chu, \{Yi Cheng\} and Chih Chen and Lyu, \{Dian Rong\} and Kuan-Neng Chen and King-Ning Tu",

year = "2014",

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doi = "10.1016/j.scriptamat.2014.01.040",

language = "English",

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T1 - Low-temperature direct copper-to-copper bonding enabled by creep on highly (1 1 1)-oriented Cu surfaces

AU - Liu, Chien Min

AU - Lin, Han Wen

AU - Chu, Yi Cheng

AU - Chen, Chih

AU - Lyu, Dian Rong

AU - Chen, Kuan-Neng

AU - Tu, King-Ning

PY - 2014/5

Y1 - 2014/5

N2 - We achieve low-temperature Cu-to-Cu direct bonding using highly (1 1 1)-orientated Cu films. The bonding temperature can be lowered to 200 C at a stress of 114 psi for 30 min at 10-3 torr. The temperature is lower than the reflow temperature of 250 C for Pb-free solders. Our breakthrough is based on the finding that the Cu (1 1 1) surface diffusivity is the fastest among all the planes of Cu and the bonding process can occur through surface diffusion creep on the (1 1 1) surfaces.

AB - We achieve low-temperature Cu-to-Cu direct bonding using highly (1 1 1)-orientated Cu films. The bonding temperature can be lowered to 200 C at a stress of 114 psi for 30 min at 10-3 torr. The temperature is lower than the reflow temperature of 250 C for Pb-free solders. Our breakthrough is based on the finding that the Cu (1 1 1) surface diffusivity is the fastest among all the planes of Cu and the bonding process can occur through surface diffusion creep on the (1 1 1) surfaces.

KW - Creep

KW - Cu-to-Cu direct bonding

KW - Diffusion

KW - Preferred orientation

UR - https://www.scopus.com/pages/publications/84900597650

U2 - 10.1016/j.scriptamat.2014.01.040

DO - 10.1016/j.scriptamat.2014.01.040

M3 - Article

AN - SCOPUS:84900597650

SN - 1359-6462

VL - 78-79

SP - 65

EP - 68

JO - Scripta Materialia

JF - Scripta Materialia

ER -

Low-temperature direct copper-to-copper bonding enabled by creep on highly (1 1 1)-oriented Cu surfaces

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