Low Temperature Cu to Cu Direct Bonding below 150 °c with Au Passivation Layer

Demin Liu, Po Chih Chen, Yi Chieh Tsai, Kuan Neng Chen

研究成果: Conference contribution同行評審

7 引文 斯高帕斯(Scopus)

摘要

In this research, Au is proposed as a new passivation material for Cu-Cu direct bonding. According to the TEM result, Cu could diffuse through the Au passivation layer to the bonding interface during the thermocompression bonding (TCB) process. In addition, the Au passivation layer can lower the bonding temperature (150 °C) and improve electrical properties, comparing to the conventional Cu-Cu bonding. Furthermore, the electrical measurement results after reliability tests show that the Au passivation method is a reliable way to reduce the bonding temperature of Cu-Cu direct bonding.

原文English
主出版物標題IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9781728148700
DOIs
出版狀態Published - 10月 2019
事件2019 IEEE International 3D Systems Integration Conference, 3DIC 2019 - Sendai, Japan
持續時間: 8 10月 201910 10月 2019

出版系列

名字IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019

Conference

Conference2019 IEEE International 3D Systems Integration Conference, 3DIC 2019
國家/地區Japan
城市Sendai
期間8/10/1910/10/19

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