Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications

Ruoh Ning Tzeng; Yan Pin Huang; Yu San Chien; Ching Te Chuang; Wei Hwang; Jin-Chern Chiou; Ming Shaw Shy; Teu Hua Lin; Kou Hua Chen; Chi Tsung Chiu; Ho Ming Tong; Kuan-Neng Chen

doi:10.1109/IITC.2013.6615572

Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications

Ruoh Ning Tzeng, Yan Pin Huang, Yu San Chien, Ching Te Chuang, Wei Hwang, Jin-Chern Chiou, Ming Shaw Shy, Teu Hua Lin, Kou Hua Chen, Chi Tsung Chiu, Ho Ming Tong, Kuan-Neng Chen

電機工程學系

研究成果: Conference contribution › 同行評審

6 引文斯高帕斯（Scopus）

摘要

A low temperature bonding technology of Sn/In composite solder bonded to Cu interconnect is proposed and investigated. The intermetallic compounds formed in the bonded interconnects can survive well in the following process. The Sn/In-Cu interconnects bonded at low temperature all exhibit excellent electrical performance and high resistance to multiple current stressing, showing a great potential in 3D applications.

原文	English
主出版物標題	Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013
DOIs	https://doi.org/10.1109/IITC.2013.6615572
出版狀態	Published - 4 11月 2013
事件	2013 16th IEEE International Interconnect Technology Conference, IITC 2013 - Kyoto, Japan 持續時間: 13 6月 2013 → 15 6月 2013

出版系列

名字	Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013

Conference

Conference	2013 16th IEEE International Interconnect Technology Conference, IITC 2013
國家/地區	Japan
城市	Kyoto
期間	13/06/13 → 15/06/13

存取文件

10.1109/IITC.2013.6615572

其它文件與鏈接

Link to publication in Scopus

引用此

Tzeng, R. N., Huang, Y. P., Chien, Y. S., Chuang, C. T., Hwang, W., Chiou, J-C., Shy, M. S., Lin, T. H., Chen, K. H., Chiu, C. T., Tong, H. M., & Chen, K-N. (2013). Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications. 於 Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013 [6615572] (Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013). https://doi.org/10.1109/IITC.2013.6615572

@inproceedings{c1211c29fe2b4871a09aade347891e1e,

title = "Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications",

abstract = "A low temperature bonding technology of Sn/In composite solder bonded to Cu interconnect is proposed and investigated. The intermetallic compounds formed in the bonded interconnects can survive well in the following process. The Sn/In-Cu interconnects bonded at low temperature all exhibit excellent electrical performance and high resistance to multiple current stressing, showing a great potential in 3D applications.",

author = "Tzeng, {Ruoh Ning} and Huang, {Yan Pin} and Chien, {Yu San} and Chuang, {Ching Te} and Wei Hwang and Jin-Chern Chiou and Shy, {Ming Shaw} and Lin, {Teu Hua} and Chen, {Kou Hua} and Chiu, {Chi Tsung} and Tong, {Ho Ming} and Kuan-Neng Chen",

year = "2013",

month = nov,

day = "4",

doi = "10.1109/IITC.2013.6615572",

language = "English",

isbn = "9781479904396",

series = "Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013",

booktitle = "Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013",

note = "null ; Conference date: 13-06-2013 Through 15-06-2013",

}

Tzeng, RN, Huang, YP, Chien, YS, Chuang, CT, Hwang, W, Chiou, J-C, Shy, MS, Lin, TH, Chen, KH, Chiu, CT, Tong, HM & Chen, K-N 2013, Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications. 於 Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013., 6615572, Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013, 2013 16th IEEE International Interconnect Technology Conference, IITC 2013, Kyoto, Japan, 13/06/13. https://doi.org/10.1109/IITC.2013.6615572

Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications. / Tzeng, Ruoh Ning; Huang, Yan Pin; Chien, Yu San 等.

Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013. 2013. 6615572 (Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013).

研究成果: Conference contribution › 同行評審

TY - GEN

T1 - Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications

AU - Tzeng, Ruoh Ning

AU - Huang, Yan Pin

AU - Chien, Yu San

AU - Chuang, Ching Te

AU - Hwang, Wei

AU - Chiou, Jin-Chern

AU - Shy, Ming Shaw

AU - Lin, Teu Hua

AU - Chen, Kou Hua

AU - Chiu, Chi Tsung

AU - Tong, Ho Ming

AU - Chen, Kuan-Neng

PY - 2013/11/4

Y1 - 2013/11/4

N2 - A low temperature bonding technology of Sn/In composite solder bonded to Cu interconnect is proposed and investigated. The intermetallic compounds formed in the bonded interconnects can survive well in the following process. The Sn/In-Cu interconnects bonded at low temperature all exhibit excellent electrical performance and high resistance to multiple current stressing, showing a great potential in 3D applications.

AB - A low temperature bonding technology of Sn/In composite solder bonded to Cu interconnect is proposed and investigated. The intermetallic compounds formed in the bonded interconnects can survive well in the following process. The Sn/In-Cu interconnects bonded at low temperature all exhibit excellent electrical performance and high resistance to multiple current stressing, showing a great potential in 3D applications.

UR - http://www.scopus.com/inward/record.url?scp=84886716441&partnerID=8YFLogxK

U2 - 10.1109/IITC.2013.6615572

DO - 10.1109/IITC.2013.6615572

M3 - Conference contribution

AN - SCOPUS:84886716441

SN - 9781479904396

T3 - Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013

BT - Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013

Y2 - 13 June 2013 through 15 June 2013

ER -

Tzeng RN, Huang YP, Chien YS, Chuang CT, Hwang W, Chiou J-C 等. Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications. 於 Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013. 2013. 6615572. (Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013). doi: 10.1109/IITC.2013.6615572

Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications

摘要

出版系列

Conference

存取文件

其它文件與鏈接

指紋

引用此