Low-temperature bonded Cu/In interconnect with high thermal stability for 3-D integration
- Yu San Chien
- , Yan Pin Huang
- , Ruoh Ning Tzeng
- , Ming Shaw Shy
- , Teu Hua Lin
- , Kou Hua Chen
- , Chi Tsung Chiu
- , Ching Te Chuang
- , Wei Hwang
- , Jin-Chern Chiou
- , Ho Ming Tong
- , Kuan-Neng Chen
研究成果: Article › 同行評審
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引文
斯高帕斯（Scopus）