Life period estimation of stamping process using punch sounds and deep neural network

Peng Jen Chen, Tsung Lun Wu, Tay Jyi Lin, Ying Hui Lai, Tsung Liang Wu, Chingwei Yeh

5 引文 斯高帕斯(Scopus)

摘要

This paper presents the life period estimation of stamping process by analyzing its punch sounds with a deep neural network (DNN). Neuro-approximated MFCC (NA-MFCC) feature extraction has also been proposed to trade estimation accuracy for computation complexity at a finer granularity. Several Pareto-optimal configurations have been reported with the performance measured on an ARM Cortex A15-based prototype.

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