Life period estimation of stamping process using punch sounds and deep neural network

Peng Jen Chen, Tsung Lun Wu, Tay Jyi Lin, Ying Hui Lai, Tsung Liang Wu, Chingwei Yeh

研究成果: Conference contribution同行評審

3 引文 斯高帕斯(Scopus)

摘要

This paper presents the life period estimation of stamping process by analyzing its punch sounds with a deep neural network (DNN). Neuro-approximated MFCC (NA-MFCC) feature extraction has also been proposed to trade estimation accuracy for computation complexity at a finer granularity. Several Pareto-optimal configurations have been reported with the performance measured on an ARM Cortex A15-based prototype.

原文English
主出版物標題Proceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019
發行者Institute of Electrical and Electronics Engineers Inc.
頁面625-628
頁數4
ISBN(電子)9781538694909
DOIs
出版狀態Published - 6月 2019
事件14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019 - Xi'an, China
持續時間: 19 6月 201921 6月 2019

出版系列

名字Proceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019

Conference

Conference14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019
國家/地區China
城市Xi'an
期間19/06/1921/06/19

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