Layout design on bond pads to improve the firmness of bond wire in packaged IC products

Jeng Jie Peng*, Ming-Dou Ker, Nien Ming Wang, Hsin Chin Jiang

*此作品的通信作者

研究成果: Conference article同行評審

2 引文 斯高帕斯(Scopus)

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Physics & Astronomy

Chemical Compounds

Engineering & Materials Science