TY - JOUR
T1 - Latchup-free ESD protection design with complementary substrate-triggered SCR devices
AU - Ker, Ming-Dou
AU - Hsu, Kuo Chun
PY - 2003/8/1
Y1 - 2003/8/1
N2 - The turn-on mechanism of silicon-controlled rectifier (SCR) devices is essentially a current triggering event. While a current is applied to the base or substrate of an SCR device, it can be quickly triggered on into its latching state. In this paper, latchup-free electrostatic discharge (ESD) protection circuits, which are combined with the substrate-triggered technique and an SCR device, are proposed. A complementary circuit style with the substrate-triggered SCR device is designed to discharge both the pad-to-Vss and pad-to-VDD ESD stresses. The novel complementary substrate-triggered SCR devices have the advantages of controllable switching voltage, adjustable holding voltage, faster turn-on speed, and compatible to general CMOS process without extra process modification such as the suicide-blocking mask and ESD implantation. The total holding voltage of the substrate-triggered SCR device can be linearly increased by adding the stacked diode string to avoid the transient-induced latchup issue in the ESD protection circuits. The on-chip ESD protection circuits designed with the proposed complementary substrate-triggered SCR devices and stacked diode string for the input/output pad and power pad have been successfully verified in a 0.25-μm salicided CMOS process with the human body model (machine model) ESD level of ∼7.25 kV (500 V) in a small layout area.
AB - The turn-on mechanism of silicon-controlled rectifier (SCR) devices is essentially a current triggering event. While a current is applied to the base or substrate of an SCR device, it can be quickly triggered on into its latching state. In this paper, latchup-free electrostatic discharge (ESD) protection circuits, which are combined with the substrate-triggered technique and an SCR device, are proposed. A complementary circuit style with the substrate-triggered SCR device is designed to discharge both the pad-to-Vss and pad-to-VDD ESD stresses. The novel complementary substrate-triggered SCR devices have the advantages of controllable switching voltage, adjustable holding voltage, faster turn-on speed, and compatible to general CMOS process without extra process modification such as the suicide-blocking mask and ESD implantation. The total holding voltage of the substrate-triggered SCR device can be linearly increased by adding the stacked diode string to avoid the transient-induced latchup issue in the ESD protection circuits. The on-chip ESD protection circuits designed with the proposed complementary substrate-triggered SCR devices and stacked diode string for the input/output pad and power pad have been successfully verified in a 0.25-μm salicided CMOS process with the human body model (machine model) ESD level of ∼7.25 kV (500 V) in a small layout area.
KW - Complementary
KW - ESD protection circuit
KW - Electrostatic discharge (ESD)
KW - Silicon-controlled rectifier (SCR)
KW - Substrate-triggered technique
UR - http://www.scopus.com/inward/record.url?scp=0042697060&partnerID=8YFLogxK
U2 - 10.1109/JSSC.2003.814434
DO - 10.1109/JSSC.2003.814434
M3 - Article
AN - SCOPUS:0042697060
SN - 0018-9200
VL - 38
SP - 1380
EP - 1392
JO - IEEE Journal of Solid-State Circuits
JF - IEEE Journal of Solid-State Circuits
IS - 8
ER -