摘要
Wafer bonding and laser lift-off (LLO) processes were employed to fabricate pattern sapphire thin-GaN light-emitting diodes LEDs (PT-LED). During the LLO process, the required laser energy for PT-LED was much higher than that for flat thin-GaN LED (FTLED). The yield rate of PT-LED was low, and the leakage current was high. In this study, the laser lift-off mechanisms of PT-LEDs were investigated.
原文 | English |
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頁(從 - 到) | R20-R22 |
期刊 | ECS Journal of Solid State Science and Technology |
卷 | 4 |
發行號 | 2 |
DOIs | |
出版狀態 | Published - 1 1月 2015 |