Laser Grooving Technology Study at Dicing Process in GaN Power Devices WLCSP

Keyphrases

• Active Area 50%
• Blade Loading 50%
• Cost Reduction 50%
• Cutting Quality 50%
• Dicing Blade 50%
• Dicing Process 100%
• Epi-wafer 50%
• GaN Power Device 100%
• Guard Ring 50%
• High Complexity 50%
• High Density 50%
• Laser Grooving 100%
• Metallization 50%
• Spindle Speed 50%
• Street Width 50%
• Technology Studies 100%
• Test Pattern 50%
• Wafer 50%
• Wafer Sawing Process 100%
• Wafer-level chip-scale Package (WLCSP) 100%

Engineering

• Active Area 100%
• Cost Reduction 100%
• Metallizations 100%
• Power Device 100%
• Speed Spindle 100%
• Spindle Speed 100%
• Test Depth 100%