Laser Grooving Technology Study at Dicing Process in GaN Power Devices WLCSP

Yao Hsing Liu, Chia Wei Sun

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

Chipping free is a dream for GaN Epi wafer sawing process. With current high complexity of wafer technology plus the drive for cost reduction by narrowing the saw street width, it is a challenge which requires huge effort for wafer sawing process to achieve chipping free process. Higher density of metallization causing higher blade loading during mechanical sawing. The critical factors (dicing blade, index speed, spindle speed, cut in depth, test pattern in the saw street, etc.) affecting cutting quality were studied and optimized. This leads to chipping penetrating under the guard ring and damaging the active area [1].

原文English
主出版物標題2021 Conference on Lasers and Electro-Optics, CLEO 2021 - Proceedings
發行者The Optical Society
ISBN(電子)9781943580910
DOIs
出版狀態Published - 5月 2021
事件2021 Conference on Lasers and Electro-Optics, CLEO 2021 - Virtual, Online, United States
持續時間: 9 5月 202114 5月 2021

出版系列

名字2021 Conference on Lasers and Electro-Optics, CLEO 2021 - Proceedings

Conference

Conference2021 Conference on Lasers and Electro-Optics, CLEO 2021
國家/地區United States
城市Virtual, Online
期間9/05/2114/05/21

指紋

深入研究「Laser Grooving Technology Study at Dicing Process in GaN Power Devices WLCSP」主題。共同形成了獨特的指紋。

引用此