Job Sequencing and Scheduling

Tin Chih Toly Chen*

*此作品的通信作者

研究成果同行評審

4 引文 斯高帕斯(Scopus)

摘要

The semiconductor manufacturing process typically consists of four stages: wafer fabrication, wafer probe, assembly, and final test.

原文English
主出版物標題SpringerBriefs in Applied Sciences and Technology
發行者Springer Science and Business Media Deutschland GmbH
頁面77-100
頁數24
DOIs
出版狀態Published - 2023

出版系列

名字SpringerBriefs in Applied Sciences and Technology
ISSN(列印)2191-530X
ISSN(電子)2191-5318

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