Investigation on ESD robustness of CMOS devices in a 1.8-V 0.15-μm partially-depleted SOI salicide CMOS technology

Ming-Dou Ker*, K. K. Hong, T. Y. Chen, H. Tang, S. C. Huang, S. S. Chen, C. T. Huang, M. C. Wang, Y. T. Loh

*此作品的通信作者

    研究成果: Paper同行評審

    1 引文 斯高帕斯(Scopus)

    摘要

    Electrostatic discharge (ESD) robustness of CMOS devices with four different layout structures fabricated in a 0.15-μm partially-depleted silicon-on-insulator (SOI) salicide CMOS process are verified by ESD tester. The second breakdown current (It2) of fabricated CMOS devices is also measured by the transmission line pulse generator (TLPG). The dependences of ESD robustness on the layout parameters of CMOS devices in this SOI CMOS process have been investigated to find the optimum layout rules for on-chip ESD protection design. The effectiveness of ESD clamp circuits designed with the gate-driven and substrate-triggered techniques are also compared in this SOI CMOS process.

    原文English
    頁面41-44
    頁數4
    DOIs
    出版狀態Published - 18 4月 2001
    事件2001 International Symposium on VLSI Technology, Systems, and Applications, Proceedings - Hsinchu, Taiwan
    持續時間: 18 4月 200120 4月 2001

    Conference

    Conference2001 International Symposium on VLSI Technology, Systems, and Applications, Proceedings
    國家/地區Taiwan
    城市Hsinchu
    期間18/04/0120/04/01

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