Investigation of Wet Pretreatment to Improve Cu-Cu Bonding for Hybrid Bonding Applications

Keyphrases

• Cu-Cu Bonding 100%
• Acetic Acid 100%
• Hybrid Bonding 100%
• Wet Treatment 100%
• Acid Solution 66%
• Sulfuric Acid 66%
• Cu Oxide 66%
• Low Temperature 33%
• Sample Pretreatment 33%
• Bonding Technology 33%
• XPS Analysis 33%
• Removal Methods 33%
• Bonding Surface 33%
• Bonding Strength 33%
• SEM Analysis 33%
• Surface Condition 33%
• Citric Acid 33%
• Chemical Reaction 33%
• Oxide-based 33%
• Thermo-compression Bonding 33%
• Cu Surface 33%
• Pull Test 33%
• Bonding Interface 33%
• Oxide Removal 33%
• Hydrochloric Acid 33%
• Immersion Time 33%
• Surface Components 33%
• Component Composition 33%
• Interface Test 33%
• Acid Immersion 33%

Engineering

• Pretreatment 100%
• Acid Solution 66%
• Low-Temperature 33%
• Bonding Technology 33%
• Bonding Strength 33%
• Surface Condition 33%
• Cu Surface 33%
• Pull Test 33%
• Component Surface 33%
• Removal Process 33%
• Hydrochloric Acid 33%
• Thermal Compression Bonding 33%
• Phase Composition 33%