Introduction to the Special Issue on the 2019 IEEE International Solid-State Circuits Conference (ISSCC)

Tony Chan Carusone*, Mingoo Seok, Hsie Chia Chang, Meng Fan Chang

*此作品的通信作者

研究成果: Review article同行評審

摘要

This Special Issue of the IEEE Journal of Solid-State Circuits is dedicated to a collection of the best articles selected from the 2019 IEEE International Solid-State Circuits Conference (ISSCC) that took place on February 17-21, 2019, in San Francisco, CA, USA. This Special Issue covers articles from the Wireline, Digital Circuits, Digital Architectures and Systems (DASs), and Memory Committees.

原文English
文章編號8944228
頁(從 - 到)3-5
頁數3
期刊IEEE Journal of Solid-State Circuits
55
發行號1
DOIs
出版狀態Published - 27 12月 2019

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