Intermetallic compounds in 3D integrated circuits technology: a brief review

Syahira Annuar, Reza Mahmoodian*, Mohd Hamdi, King-Ning Tu

*此作品的通信作者

研究成果: Review article同行評審

73 引文 斯高帕斯(Scopus)

摘要

The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-free solder microbumps are intended to replace conventional Pb-containing solder joints due to the rising awareness of environmental preservation. The use of low-volume solder microbumps has led to crucial constraints that cause several reliability issues, including excessive intermetallic compounds (IMCs) formation and solder microbump embrittlement due to IMCs growth. This article reviews technologies related to 3D-ICs, IMCs formation mechanisms and reliability issues concerning IMCs with Pb-free solder microbumps. Finally, future outlook on the potential growth of research in this area is discussed.

原文English
頁(從 - 到)693-703
頁數11
期刊Science and Technology of Advanced Materials
18
發行號1
DOIs
出版狀態Published - 31 12月 2017

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