TY - GEN
T1 - Intelligent Modeling of Electrical Characteristics of Multi-Channel Gate All Around Silicon Nanosheet MOSFETs Induced by Work Function Fluctuation
AU - Akbar, Chandni
AU - Li, Yiming
AU - Sung, Wen Li
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - Intelligent model (IM) of device and performance prediction is an emerging methodology in the IC industry. This paper for the first time presents an optimized intelligent model approach based on an artificial neural network (ANN) to study the effects of a crucial source of variation, i.e., work function fluctuation (WKF) of multi-channel (MC) gate-all-around (GAA) silicon (Si) nanosheet (NS) MOSFET. Various fluctuated devices are simulated and their ID-VG curves, as well as their extracted electrical properties, are investigated using IM based ANN algorithm. These predicted electrical properties are estimated accurately and show that on-current (ION) is decreased from top contacts to the bottom source/drain contact as the electrostatic potential (V) is decreasing in MC GAA Si NS MOSFET. IM-based ANN methodology has negligible computational cost as compared to 3D device simulation. Therefore, this intelligent modeling approach can be utilized to accelerate the device simulation for advanced semiconductor nano-devices.
AB - Intelligent model (IM) of device and performance prediction is an emerging methodology in the IC industry. This paper for the first time presents an optimized intelligent model approach based on an artificial neural network (ANN) to study the effects of a crucial source of variation, i.e., work function fluctuation (WKF) of multi-channel (MC) gate-all-around (GAA) silicon (Si) nanosheet (NS) MOSFET. Various fluctuated devices are simulated and their ID-VG curves, as well as their extracted electrical properties, are investigated using IM based ANN algorithm. These predicted electrical properties are estimated accurately and show that on-current (ION) is decreased from top contacts to the bottom source/drain contact as the electrostatic potential (V) is decreasing in MC GAA Si NS MOSFET. IM-based ANN methodology has negligible computational cost as compared to 3D device simulation. Therefore, this intelligent modeling approach can be utilized to accelerate the device simulation for advanced semiconductor nano-devices.
UR - http://www.scopus.com/inward/record.url?scp=85142930189&partnerID=8YFLogxK
U2 - 10.1109/NANO54668.2022.9928611
DO - 10.1109/NANO54668.2022.9928611
M3 - Conference contribution
AN - SCOPUS:85142930189
T3 - Proceedings of the IEEE Conference on Nanotechnology
SP - 261
EP - 264
BT - 2022 IEEE 22nd International Conference on Nanotechnology, NANO 2022
PB - IEEE Computer Society
T2 - 22nd IEEE International Conference on Nanotechnology, NANO 2022
Y2 - 4 July 2022 through 8 July 2022
ER -