@inproceedings{59805e24be734173909194566657be2c,
title = "Integration of neural sensing microsystem with TSV-embedded dissolvable μ-needles array, biocompatible flexible interposer, and neural recording circuits",
abstract = "Local brain connectivity is expected to lead to new models for neurological diseases, which may in turn result in advanced understanding and better treatment. This paper presents a neural sensing microsystem integrated with TSV-embedded dissolvable μ-needles array, ENIG bonding technology, biocompatible Au-TSV flexible interposer and neural recording circuits, for neural sensing implantation. An ultra-Thin film bonding approach is proposed for integration of interposer assembly. Removing bonding wire by proposed bonding technology, the dimension of neural sensing system can be minimized to reduce surgical area and promote implant success rate. The signal quality of neural recording can be significantly improved by eliminating complex signal paths with 2.5D TSV integration from neural sensing interface to neural recording circuits.",
keywords = "2.5D, TSV, flexible, interposer, neural sensing",
author = "Huang, {Yu Chieh} and Hu, {Yu Chen} and Po-Tsang Huang and Wu, {Shang Lin} and You, {Yan Huei} and Chen, {Jr Ming} and Huang, {Yan Yu} and Chang, {Hsiao Chun} and Lin, {Yen Han} and Jeng-Ren Duann and Tzai-Wen Chiu and Wei Hwang and Ching-Te Chuang and Jin-Chern Chiou and Kuan-Neng Chen",
note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 36th IEEE Symposium on VLSI Technology, VLSI Technology 2016 ; Conference date: 13-06-2016 Through 16-06-2016",
year = "2016",
month = sep,
day = "21",
doi = "10.1109/VLSIT.2016.7573441",
language = "English",
series = "Digest of Technical Papers - Symposium on VLSI Technology",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2016 IEEE Symposium on VLSI Technology, VLSI Technology 2016",
address = "美國",
}