Integration of energy-recycling logic and wireless power transfer for ultra-low-power implantables

Hsin Tzu Lin, Yi Chung Wu, Ping Hsuan Hsieh, Chia Hsiang Yang

研究成果: Conference contribution同行評審

2 引文 斯高帕斯(Scopus)

摘要

This paper presents an integration of energy-recycling logic circuits with a wireless power transfer receiving module for ultra-low-power applications, such as transcutaneous biomedical implantables. In the prototype design, one inductive coil implanted inside the body receives wireless power and supplies the following electronics. While part of the loading is composed of conventional CMOS logics, the rest is implemented with energy-recycling logic circuits. Energy-recycling logic and the associated adiabatic operation achieve excellent energy efficiency by transferring and recycling energy between digital logic blocks along with the signal propagation. The required AC supplies further lead to a natural integration with wireless power transfer and therefore obviate the need for a rectifier that contributes to substantial power loss. As a proof of concept, a finite-impulse-response filter is designed in 90-nm CMOS process. Simulation results show a 59.3% power reduction as compared to static CMOS counterpart.

原文English
主出版物標題IEEE International Symposium on Circuits and Systems
主出版物子標題From Dreams to Innovation, ISCAS 2017 - Conference Proceedings
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9781467368520
DOIs
出版狀態Published - 25 9月 2017
事件50th IEEE International Symposium on Circuits and Systems, ISCAS 2017 - Baltimore, United States
持續時間: 28 5月 201731 5月 2017

出版系列

名字Proceedings - IEEE International Symposium on Circuits and Systems
ISSN(列印)0271-4310

Conference

Conference50th IEEE International Symposium on Circuits and Systems, ISCAS 2017
國家/地區United States
城市Baltimore
期間28/05/1731/05/17

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