@inproceedings{fa101ef5bddc4904ad69338479fc2ee7,
title = "Integration, electrical performance, and Reliability Investigation of TSV",
author = "Lee, {S. W.} and Hu, {Y. C.} and Chiang, {C. H.} and Chen, {K. H.} and Chiu, {C. T.} and Chuang, {C. T.} and Wei Hwang and Jin-Chern Chiou and Tong, {H. M.} and Kuan-Neng Chen",
year = "2013",
month = dec,
day = "18",
doi = "10.4071/2013DPC-tha12",
language = "English",
isbn = "9781627487740",
series = "International Conference and Exhibition on Device Packaging 2013",
pages = "172--186",
booktitle = "International Conference and Exhibition on Device Packaging 2013",
note = "null ; Conference date: 11-03-2013 Through 14-03-2013",
}