Integrated silicon-polymer laterally stacked bender for sensing microgrippers

T. Chu Duc, J. Wei, P. M. Sarro, Gih Keong Lau

研究成果: Conference contribution同行評審

6 引文 斯高帕斯(Scopus)

摘要

This paper presents a novel electro-thermal microgripper based on integrated silicon-polymer laterally stacked microactuators. The device consists of a serpentine-shape deep silicon structure with a thin film aluminum heater on the top and filling polymer in the trenches among the vertical silicon parts. The fabrication is based on deep reactive ion etching of silicon, aluminum sputtering and SU8 filling. The actuator is 500 μm long, 65 μm wide and 50 μm high. The microgripper generates a large motion up to 52 μm at a driving voltage of only 2 V and with a power consumption of 50 mW. The maximum working temperature is 164°C at 2 V.

原文English
主出版物標題2006 5th IEEE Conference on Sensors
頁面662-665
頁數4
DOIs
出版狀態Published - 2006
事件2006 5th IEEE Conference on Sensors - Daegu, 韓國
持續時間: 22 10月 200625 10月 2006

出版系列

名字Proceedings of IEEE Sensors

Conference

Conference2006 5th IEEE Conference on Sensors
國家/地區韓國
城市Daegu
期間22/10/0625/10/06

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