Integrated microprobe array and CMOS MEMS by TSV technology for bio-signal recording application

Lei Chun Chou*, Shih Wei Lee, Po-Tsang Huang, Chih Wei Chang, Shang Lin Wu, Jin-Chern Chiou, Ching Te Chuang, Wei Hwang, Chung Hsi Wu, Kuo Hua Chen, Chi Tsung Chiu, Ho Ming Tong, Kuan-Neng Chen

*此作品的通信作者

研究成果: Conference contribution同行評審

4 引文 斯高帕斯(Scopus)

摘要

Bio-signal probes that provide stable observation with high-quality signals are crucial for understanding how the brain works and how the neural signal transmits. Because bio-signals are weak and noisy, the length of the string connecting the sensor and Complementary Metal-Oxide-Semiconductor (CMOS) circuit significantly impacts biosignal quality. The collected weak signals from the sensor must pass through a series of interconnections and interfaces that introduce noise and lead to bulky packaged systems. This work uses through-silicon via (TSV) technology to connect the μ-probe array bio-sensor and CMOS circuit located on opposite sides of a chip for brain neural sensing applications. With the elimination of wire bonding and the reduction of the soldering, bio-signal quality can be significantly improved.

原文English
主出版物標題Proceedings - Electronic Components and Technology Conference
發行者Institute of Electrical and Electronics Engineers Inc.
頁面512-517
頁數6
ISBN(電子)9781479924073
DOIs
出版狀態Published - 11 9月 2014
事件64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United States
持續時間: 27 5月 201430 5月 2014

出版系列

名字Proceedings - Electronic Components and Technology Conference
ISSN(列印)0569-5503

Conference

Conference64th Electronic Components and Technology Conference, ECTC 2014
國家/地區United States
城市Orlando
期間27/05/1430/05/14

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