Innovative Stacked Yellow and Blue Mini-LED Chip for White Lamp Applications

Tzu Yi Lee, Chien Chi Huang, Wen Chien Miao, Fu He Hsiao, Chia Hung Tsai, Yu Ying Hung, Fang Chung Chen, Chun Liang Lin, Kazuhiro Ohkawa, Jr Hau He, Yu Heng Hong*, Hao Chung Kuo*

*此作品的通信作者

研究成果: Article同行評審

摘要

This study introduces a novel approach for fabricating vertically stacked mini-LED arrays, integrating InGaN yellow and blue epitaxial layers with a stress buffer layer to enhance optoelectronic characteristics and structural stability. This method significantly simplifies the LED design by reducing the need for RGB configurations, thus lowering costs and system complexity. Employing vertical stacking integration technology, the design achieves high-density, efficient white light production suitable for multifunctional applications, including automotive lighting and outdoor signage. Experimental results demonstrate the exceptional performance of the stacked yellow and blue mini-LEDs in terms of luminous efficiency, wavelength precision, and thermal stability. The study also explores the performance of these LEDs under varying temperature conditions and their long-term reliability, indicating that InGaN-based yellow LEDs offer superior performance over traditional AlGaInP yellow LEDs, particularly in high-temperature environments. This technology promises significant advancements in the design and application of lighting systems, with potential implications for both automotive and general illumination markets.

原文English
文章編號796
期刊Micromachines
15
發行號6
DOIs
出版狀態Published - 6月 2024

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