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InGaN-based light-emitting diode with undercut side wall

  • Chih Chiang Kao*
  • , J. T. Chu
  • , H. W. Huang
  • , Y. C. Peng
  • , C. C. Yu
  • , Y. L. Hseih
  • , C. F. Lin
  • , Hao-Chung Kuo
  • , S. C. Wang
  • *此作品的通信作者

研究成果: Conference article同行評審

1 引文 斯高帕斯(Scopus)

摘要

Indium gallium nitride (InGaN)-based light emitted diodes (LED) with ∼ 22° undercut side walls were fabricated by controllable inductively coupled plasma reactive ion-etching (ICP-RIE). The structure of the LEDs consisted 30-nm-thick low temperature GaN nucleation layer, and an undoped 5 period InGaN-GaN multiple quantum well (MQW) active region with emission at ∼470 nm at 20 mA operation. Current-voltage characteristics of these diodes were also measured. It was observed that with a 20-mA current injection, the output powers of the LED with ∼ 22° undercut side walls and normal LEd were about 5 and 3 mW respectively.

原文English
頁(從 - 到)286-287
頁數2
期刊Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
1
DOIs
出版狀態Published - 2004
事件2004 IEEE LEOS Annual Meeting Conference Proceedings, LEOS 2004 - Rio Grande, 波多黎各
持續時間: 7 11月 200411 11月 2004

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