摘要
Indium gallium nitride (InGaN)-based light emitted diodes (LED) with ∼ 22° undercut side walls were fabricated by controllable inductively coupled plasma reactive ion-etching (ICP-RIE). The structure of the LEDs consisted 30-nm-thick low temperature GaN nucleation layer, and an undoped 5 period InGaN-GaN multiple quantum well (MQW) active region with emission at ∼470 nm at 20 mA operation. Current-voltage characteristics of these diodes were also measured. It was observed that with a 20-mA current injection, the output powers of the LED with ∼ 22° undercut side walls and normal LEd were about 5 and 3 mW respectively.
| 原文 | English |
|---|---|
| 頁(從 - 到) | 286-287 |
| 頁數 | 2 |
| 期刊 | Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS |
| 卷 | 1 |
| DOIs | |
| 出版狀態 | Published - 2004 |
| 事件 | 2004 IEEE LEOS Annual Meeting Conference Proceedings, LEOS 2004 - Rio Grande, 波多黎各 持續時間: 7 11月 2004 → 11 11月 2004 |
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