@inproceedings{2434b804dcef4f70badb2bd9eded89ad,
title = "In-situ resist temperature monitor during hot embossing lithography by fluorescence probe technique",
abstract = "A fluorescence probe method was used to record the highest temperature in resist deformation processes. The fluorescence temperature measurement is a rapid, high precision, high accuracy, and a robust method. To calibrate the temperature measurement for a long heating time, the mixed resist was heated continuously up to 9 hrs. The method was found to be applicable to the in-situ temperature variation inspection on whole wafer but also helpful in investigating the resist deformation processes during embossing processes.",
author = "Fu-Hsiang Ko and Hwang, {Hsin Yen} and Chen, {Mei Fen} and Weng, {Li Yu} and Ko, {Chu Jung} and Chen, {Hsuen Li}",
year = "2004",
doi = "10.1109/IMNC.2004.245761",
language = "English",
isbn = "4990247205",
series = "Digest of Papers - Microprocesses and Nanotechnology 2004",
pages = "136--137",
booktitle = "Digest of Papers - Microprocesses and Nanotechnology 2004",
note = "2004 International Microprocesses and Nanotechnology Conference ; Conference date: 26-10-2004 Through 29-10-2004",
}