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In situ high-resolution thermal microscopy on integrated circuits
Guan Yu Zhuo,
Hai-Ching Su
, Hsien Yi Wang,
Ming-Che Chan
*
*
此作品的通信作者
照明與能源光電研究所
光電系統研究所
研究成果
:
Article
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同行評審
6
引文 斯高帕斯（Scopus）
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Keyphrases
In Situ
100%
High-resolution
100%
Integrated Circuits
100%
Thermal Microscopy
100%
Heat Dissipation
33%
Abnormal Heat
33%
Spatial Resolution
16%
Two-photon Fluorescence
16%
Temperature Effect
16%
Electrostatic Discharge
16%
Thermally Induced
16%
Rhodamine 6G (Rh6G)
16%
Miniaturization
16%
Non-contact
16%
Microscopic Image
16%
Induced Defects
16%
Work-based
16%
Circuit Development
16%
Spatial Imaging
16%
Thermal Imaging
16%
Acquisition Speed
16%
Overvoltage Breakdown
16%
Imaging Acquisition
16%
Hotspot Analysis
16%
Thermal Analytical Techniques
16%
Engineering
High Resolution
100%
Integrated Circuit
100%
Heat Losses
33%
Electrostatic Discharge
16%
Spatial Resolution
16%
Overvoltage
16%
Induced Defect
16%
Convective Flow
16%
Chemistry
Chilling
100%
Rhodamine 6G
50%
Electrostatic Discharge
50%
Overvoltage
50%
Convective Flow
50%
Physics
Integrated Circuit
100%
High Resolution
100%
Chilling
33%
Electrostatics
16%
Rhodamine
16%
Convective Flow
16%
Material Science
Electronic Circuit
100%
Analytical Method
16%
Chemical Engineering
Chilling
100%