In-Memory Annealing Unit (IMAU): Energy-Efficient (2000 TOPS/W) Combinatorial Optimizer for Solving Travelling Salesman Problem

Ming Chun Hong, Le Chih Cho, Chih Sheng Lin, Yu Hui Lin, Po An Chen, I. Ting Wang, Pei Jer Tzeng, Shyh Shyuan Sheu, Wei Chung Lo, Chih I. Wu, Tuo Hung Hou*

*此作品的通信作者

研究成果: Conference contribution同行評審

5 引文 斯高帕斯(Scopus)

摘要

An in-memory annealing unit (IMAU) as an energy-efficient combinatorial optimizer for solving the travelling salesman problem (TSP) has been demonstrated for the first time. A hardware-algorithm co-optimization approach is adopted to overcome the challenges of solving TSP using IMAU, such as large problem size, insufficient weight precision, and inaccurate analog computing. The high-capacity (1152x1024) binary RRAM-based IMAU with an embedded simulated annealing (SA) function achieves an extremely high throughput of 90 TOPS and energy efficiency of 2000 TOPS/W. A new multi-step SA algorithm is proposed to solve the otherwise floating-point TSP using merely 5-level (2.3 bit) weights and achieves the floating point-equivalent shortest route for the 10-city TSP in IMAU.

原文English
主出版物標題2021 IEEE International Electron Devices Meeting, IEDM 2021
發行者Institute of Electrical and Electronics Engineers Inc.
頁面21.3.1-21.3.4
ISBN(電子)9781665425728
DOIs
出版狀態Published - 2021
事件2021 IEEE International Electron Devices Meeting, IEDM 2021 - San Francisco, United States
持續時間: 11 12月 202116 12月 2021

出版系列

名字Technical Digest - International Electron Devices Meeting, IEDM
2021-December
ISSN(列印)0163-1918

Conference

Conference2021 IEEE International Electron Devices Meeting, IEDM 2021
國家/地區United States
城市San Francisco
期間11/12/2116/12/21

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