TY - GEN
T1 - Improving Electrically Evoked Compound Action Potential Based on Electrical Field Imaging and Electrode Interfaces
AU - Choi, Charles T.M.
AU - Ke, Chun Ting
AU - Lawrence, Jelani
AU - Wang, Alexander C.C.
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - The electrically evoked compound action potential (ECAP) has been used in various clinical studies and has become a key physiological signal for cochlear implants (CI). This study used four sensing electrodes to record ECAP signals based on the alternating polarity approach. An electrical field imaging (EFI) result based on the finite element method was used to obtain the interface impedance, then ECAP simulation results were computed and compared with a patient's clinical ECAP measurements. Preliminary modeling results show that the interface impedance obtained by this EFI-based technique can improve the simulation accuracy of the ECAP model. The ECAP modeling result will be compared with clinical ECAP measurements to validate the model in the full paper.
AB - The electrically evoked compound action potential (ECAP) has been used in various clinical studies and has become a key physiological signal for cochlear implants (CI). This study used four sensing electrodes to record ECAP signals based on the alternating polarity approach. An electrical field imaging (EFI) result based on the finite element method was used to obtain the interface impedance, then ECAP simulation results were computed and compared with a patient's clinical ECAP measurements. Preliminary modeling results show that the interface impedance obtained by this EFI-based technique can improve the simulation accuracy of the ECAP model. The ECAP modeling result will be compared with clinical ECAP measurements to validate the model in the full paper.
KW - auditory nerve
KW - cochlear implants
KW - electrical field imaging
KW - electrically evoked compound action potential
KW - finite element method
KW - optimization
UR - http://www.scopus.com/inward/record.url?scp=85199980004&partnerID=8YFLogxK
U2 - 10.1109/CEFC61729.2024.10585792
DO - 10.1109/CEFC61729.2024.10585792
M3 - Conference contribution
AN - SCOPUS:85199980004
T3 - CEFC 2024 - 21st IEEE Biennial Conference on Electromagnetic Field Computation
BT - CEFC 2024 - 21st IEEE Biennial Conference on Electromagnetic Field Computation
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st IEEE Biennial Conference on Electromagnetic Field Computation, CEFC 2024
Y2 - 2 June 2024 through 5 June 2024
ER -