Improvement on intrinsic electrical properties of low-k hydrogen silsesquioxane/copper interconnects employing deuterium plasma treatment

Po-Tsun Liu, Ting Chang Chang, Ya Liang Yang, Yi Fang Cheng, Jae Kyun Lee, Fu Yung Shih, Eric Tsai, Grace Chen, Simon M. Sze

研究成果: Article同行評審

23 引文 斯高帕斯(Scopus)

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Engineering & Materials Science

Chemical Compounds