Improvement of post-chemical mechanical planarization characteristics on organic low k methylsilsesquioxane as intermetal dielectric
Po-Tsun Liu, Ting Chang Chang, Ming Chih Huang, Ya Liang Yang, Yi Shian Mor, M. S. Tsai, H. Chung, J. Hou, Simon M. Sze
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斯高帕斯（Scopus）