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Improvement in heat dissipation capability of GaN-based light-emitting diodes
Ray-Hua Horng
*
, Sin Liang Ou, Dong Sing Wuu
*
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電子研究所
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深入研究「Improvement in heat dissipation capability of GaN-based light-emitting diodes」主題。共同形成了獨特的指紋。
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Keyphrases
Light-emitting Diodes
100%
GaN-based Light-emitting Diodes
100%
Heat Dissipation Capability
100%
Heat Dissipation
50%
High Performance
16%
High Efficiency
16%
Sapphire Substrate
16%
Thermal Resistance
16%
Sapphire
16%
Liquid Crystal Display
16%
Light Output
16%
Device Characteristics
16%
Light-emitting Diode Device
16%
Chemical Mechanical Polishing
16%
Diode Structures
16%
Light Extraction
16%
High Brightness
16%
Optoelectronic Properties
16%
Wafer Bonding
16%
Laser Lift-off
16%
Light Property
16%
General Lighting
16%
Surface Temperature
16%
Thermal Light
16%
Performance Deterioration
16%
Diamond Heat Spreader
16%
Cup-shaped
16%
Copper Sheet
16%
Mirror Coatings
16%
Metal Mirror
16%
Traffic Signals
16%
Copper Electroplating
16%
Carbon Layer
16%
Diamond-like Carbon
16%
Diamond-copper Composites
16%
Engineering
Light-Emitting Diode
100%
Heat Losses
100%
Sapphire Substrate
9%
Diamond
9%
Liquid Crystal Display
9%
Light Output Power
9%
Carbon Layer
9%
Light Extraction
9%
Chemical Mechanical Polishing
9%
Wafer Bonding
9%
Optoelectronics
9%
Performance Deterioration
9%
Diamond-Like Carbon
9%
Heat Resistance
9%
Material Science
Light-Emitting Diode
100%
Sapphire
18%
Heat Resistance
9%
Diamond
9%
Liquid Crystal Display
9%
Chemical Mechanical Planarization
9%
Electroplating
9%
Diamond-Like Carbon
9%
Surface (Surface Science)
9%
Chemical Engineering
Cooling
100%
Electrodeposition
25%