Improved GaAs wafer bonding process for quasi-phase-matched (QPM) second harmonic generation (SHG)

Yew-Chuhg Wu*, Robert S. Feigelson, Roger K. Route, Dong Zheng, Leslie A. Gordon, Martin M. Fejer, Robert L. Byer

*此作品的通信作者

研究成果: Conference article › 同行評審

1 引文 斯高帕斯（Scopus）

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Keyphrases

Engineering

Material Science