Impact of layout pickups to ESD robustness of MOS transistors in sub 100-nm CMOS process

Ming-Dou Ker*, Yong Ru Wen, Wen Yi Chen, Chun Yu Lin

*此作品的通信作者

    研究成果: Conference contribution同行評審

    11 引文 斯高帕斯(Scopus)

    摘要

    Electrostatic discharge (ESD) is an inevitable event in CMOS integrated circuits. Layout structure is one of the im portant factors that affect ESD robustness of MOS transistors. In this work, the impact of inserting additional layout pickups to ESD robustness of both multi-finger NMOS and PMOS transistors has been studied in a 90-nm CMOS process. Measurement results have shown that multi-finger MOS transistors without additional pickup inserted into their source regions can sustain a higher ESD protection level at the same effective device dimension.

    原文English
    主出版物標題2010 International Symposium on Next-Generation Electronics, ISNE 2010 - Conference Program
    頁面100-103
    頁數4
    DOIs
    出版狀態Published - 1 12月 2010
    事件2010 International Symposium on Next-Generation Electronics, ISNE 2010 - Kaohsiung, 台灣
    持續時間: 18 11月 201019 11月 2010

    出版系列

    名字2010 International Symposium on Next-Generation Electronics, ISNE 2010 - Conference Program

    Conference

    Conference2010 International Symposium on Next-Generation Electronics, ISNE 2010
    國家/地區台灣
    城市Kaohsiung
    期間18/11/1019/11/10

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