TY - GEN
T1 - Identifying and filling occlusion holes on planar surfaces for 3-D scene editing
AU - Wang, Chia Wei
AU - Yang, Tzu Chieh
AU - Chiang, Sheng Ho
AU - Wang, Tsai-Pei
PY - 2018/2/5
Y1 - 2018/2/5
N2 - While it is very convenient to acquire 3-D models of indoor environments today, to edit such an environment is not as easy, as the moving of any object will likely result in exposed occlusion holes. This paper presents a method of automatically identifying and filling such occlusion holes on planar surfaces in 3-D scenes. Steps of hole extraction, classification, and filling using a 2-D image inpainting technique are discussed.
AB - While it is very convenient to acquire 3-D models of indoor environments today, to edit such an environment is not as easy, as the moving of any object will likely result in exposed occlusion holes. This paper presents a method of automatically identifying and filling such occlusion holes on planar surfaces in 3-D scenes. Steps of hole extraction, classification, and filling using a 2-D image inpainting technique are discussed.
UR - http://www.scopus.com/inward/record.url?scp=85050377672&partnerID=8YFLogxK
U2 - 10.1109/APSIPA.2017.8282053
DO - 10.1109/APSIPA.2017.8282053
M3 - Conference contribution
AN - SCOPUS:85050377672
T3 - Proceedings - 9th Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, APSIPA ASC 2017
SP - 251
EP - 254
BT - Proceedings - 9th Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, APSIPA ASC 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 9th Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, APSIPA ASC 2017
Y2 - 12 December 2017 through 15 December 2017
ER -