Identifying and filling occlusion holes on planar surfaces for 3-D scene editing

Chia Wei Wang, Tzu Chieh Yang, Sheng Ho Chiang, Tsai-Pei Wang

研究成果: Conference contribution同行評審

4 引文 斯高帕斯(Scopus)

摘要

While it is very convenient to acquire 3-D models of indoor environments today, to edit such an environment is not as easy, as the moving of any object will likely result in exposed occlusion holes. This paper presents a method of automatically identifying and filling such occlusion holes on planar surfaces in 3-D scenes. Steps of hole extraction, classification, and filling using a 2-D image inpainting technique are discussed.

原文English
主出版物標題Proceedings - 9th Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, APSIPA ASC 2017
發行者Institute of Electrical and Electronics Engineers Inc.
頁面251-254
頁數4
ISBN(電子)9781538615423
DOIs
出版狀態Published - 5 二月 2018
事件9th Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, APSIPA ASC 2017 - Kuala Lumpur, Malaysia
持續時間: 12 十二月 201715 十二月 2017

出版系列

名字Proceedings - 9th Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, APSIPA ASC 2017
2018-February

Conference

Conference9th Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, APSIPA ASC 2017
國家/地區Malaysia
城市Kuala Lumpur
期間12/12/1715/12/17

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