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Hot embossing in microfabrication. Part II: Rheological characterization and process analysis
Yi Je Juang,
L. Lee James
, Kurt W. Koelling
生物藥學研究所
研究成果
:
Article
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同行評審
113
引文 斯高帕斯（Scopus）
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Keyphrases
Flow Pattern
100%
Hot Embossing
100%
Microfabrication
100%
Character Analysis
100%
Process Analysis
100%
Displacement Curve
100%
Extensional Viscosity
100%
Rheological Processes
100%
Rheological Characterization
100%
Temperature Sensitivity
66%
Polymer Flow
66%
Shear Viscosity
66%
Dynamic Shear
66%
Compress
33%
Numerical Simulation
33%
Embossing Process
33%
Poly(methyl methacrylate)
33%
Glass Transition Temperature
33%
Rheological Properties
33%
Non-isothermal
33%
Polyvinyl Butyral
33%
Polymer Substrate
33%
Air Entrainment
33%
Simulated Flow
33%
Initial Displacement
33%
Strain Hardening Effect
33%
Engineering
Transients
100%
Isothermal
100%
Microfabrication
100%
Fluid Viscosity
100%
Displacement Curve
100%
Flow Pattern
66%
Shear Viscosity
66%
Experimental Result
33%
Simulated Result
33%
Experimental Observation
33%
Polymer Substrate
33%
Late Stage
33%
Polycarbonate
33%
Hardening Effect
33%
Polyvinyl Butyral
33%
Computer Simulation
33%
Flow Distribution
33%
Strain Hardening
33%
Material Science
Glass Transition Temperature
100%
Microfabrication
100%
Polycarbonate
100%
Work Hardening
100%
Earth and Planetary Sciences
Process Analysis
100%
Embossing
100%
Flow Pattern
28%
Fungi
28%
Flow Distribution
14%
Glass Transition Temperature
14%
Rheology
14%