摘要
In this article, we have demonstrated the utilization of innovative atomic-layer-deposited (ALD) ultrathin (1.8 nm) amorphous InSnZnO (α -ITZO) channel material in the development of a back-end-of-line (BEOL) compatible thin film transistor (TFT). Through the optimization of the indium/tin/zinc (In/Sn/Zn) ratio, the bottom gate (BG) TFT with In0.83Sn0.11Zn0.06O channel and the channel length (Lch) of 40 nm demonstrates remarkable performances, including positive threshold voltage (Vth) of 0.38 V, excellent subthreshold swing (SS) value of 66.4 mV/dec, high field-effect mobility (μ FE) of 48 cm2/V-s, maximum ON-state current density (ION) of 686μ Aμ m at VDS = 2 V (@VG = 4 V), and extremely low drain-induced barrier lowering (DIBL) performance of 22 mV/V. Furthermore, the excellent stabilities of the α -ITZO TFT were shown by negative bias stress (NBS) and positive bias stress (PBS) under VG of (Vth± 3 V), and Vth shift (Δ Vth ) of -40 and 60 mV (Lch = 700 nm) after 3600 s was exhibited. We also simulated the current gain cutoff frequency (fT) by technology computer-aided design (TCAD) simulation to further investigate the potential of radio frequency (RF) applications. These results establish a competitive standard for TFTs based on quaternary ultrathin (Tch < 5 nm) amorphous oxide semiconductors (AOSs).
原文 | English |
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頁(從 - 到) | 3671-3677 |
頁數 | 7 |
期刊 | IEEE Transactions on Electron Devices |
卷 | 71 |
發行號 | 6 |
DOIs | |
出版狀態 | Published - 1 6月 2024 |