Highly reliable chemical-mechanical polishing process for organic low-k methylsilsesquioxane

Po-Tsun Liu*, Ting Chang Chang, Ming Chih Huang, M. S. Tsai, S. M. Sze

*此作品的通信作者

研究成果: Conference article同行評審

2 引文 斯高帕斯(Scopus)

指紋

深入研究「Highly reliable chemical-mechanical polishing process for organic low-k methylsilsesquioxane」主題。共同形成了獨特的指紋。

Engineering & Materials Science

Physics & Astronomy