High-sensitivity CMUT with interlayer metal architecture for medical ultrasonic systems

Teng Chuan Cheng, Yu-Te Liao, Tsung Heng Tsai

研究成果: Conference contribution同行評審

4 引文 斯高帕斯(Scopus)

摘要

This paper presents an integration of the capacitive micromachined ultrasonic transducers (CMUTs) and the transimpedance amplifier in medical ultrasound systems. The proposed CMUT and the sensing circuits are both fabricated on the same chip in a 0.18μm CMOS MEMS technology. Two interlayer metal structures are proposed to improve the sensitivity. The CMUTs are designed with 2MHz cells for medical diagnosis. The conversion efficiency of the CMUTs is 4 times and 1.8 times higher than that in the published structures.

原文English
主出版物標題2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
發行者Institute of Electrical and Electronics Engineers Inc.
頁面1211-1214
頁數4
ISBN(電子)9781479989553
DOIs
出版狀態Published - 21 6月 2015
事件18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 - Anchorage, 美國
持續時間: 21 6月 201525 6月 2015

出版系列

名字2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015

Conference

Conference18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
國家/地區美國
城市Anchorage
期間21/06/1525/06/15

指紋

深入研究「High-sensitivity CMUT with interlayer metal architecture for medical ultrasonic systems」主題。共同形成了獨特的指紋。

引用此