High-performance integration of copper interconnects with low-k hydrogen silsesquioxane employing deuterium plasma treatment

Po-Tsun Liu*, TC Chang, YL Yang, YF Cheng, JK Lee, FY Shih, E Tsai, G Chen, SM Sze

*此作品的通信作者

研究成果: Conference contribution › 同行評審

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Keyphrases

Material Science

Chemical Engineering