High-mobility ingazno tfts using atmospheric pressure plasma jet technique and 248-nm excimer laser annealing

With the advantages of low apparatus cost, better suitability for large-scale fabrication, and low thermal budget, the nonvacuum atmospheric pressure plasma jet technique and 248-nm excimer laser annealing were employed for the fabrication of indium gallium zinc oxide (InGaZnO) thin-film transistors. Devices with a 150-mJ/cm² laser demonstrated excellent electrical characteristics with reduced OFF-current, including a high channel mobility of 21.2 cm²/V-s, the ON-OFF current ratio of 7×10⁵, and a subthreshold swing of 0.48 V/decade. The improvements are attributed to the increase of oxygen vacancies in the InGaZnO channel and the reduction of traps at the ZrO₂/InGaZnO interface and InGaZnO bulk.