摘要
This article presents a chip-scale package (CSP) with conformal and uniform structures for white light-emitting diodes used in lighting and backlight unit (BLU) applications. The CSP structures produce higher light extraction efficiency and lower assembly-dependent packaging compared with conventional surface-mounted devices (SMDs). Simulation results show that compared with SMDs, the luminous efficiency of CSP structures is 8.81% higher in lighting applications and 9.43% higher in BLU applications. This is likely due to light loss in the light bowl of the SMDs. Moreover, CSPs with a conformal phosphor structure exhibit low assembly dependence and redundancy, and rb-CSPs with a conformal structure are a more effective light source in both lighting and BLU applications.
原文 | English |
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文章編號 | 14087SS |
頁(從 - 到) | 57606 |
頁數 | 1 |
期刊 | Journal of Photonics for Energy |
卷 | 5 |
發行號 | 1 |
DOIs | |
出版狀態 | Published - 21 4月 2015 |