HEAT CONDUCTING MODULE

Wang, C.-C. (2018). HEAT CONDUCTING MODULE. (專利號 US 10,082,349 B2).

Wang, Chi-Chuan (Inventor). / HEAT CONDUCTING MODULE. 專利號: US 10,082,349 B2. 9月 25, 2018.

@misc{210da53d50de48abb3f88e8f14af677b,

title = "HEAT CONDUCTING MODULE",

author = "Chi-Chuan Wang",

year = "2018",

month = sep,

day = "25",

language = "English",

type = "Patent",

note = "US 10,082,349 B2",

}

Wang, C-C 9月. 25 2018, HEAT CONDUCTING MODULE, 專利號 US 10,082,349 B2.

HEAT CONDUCTING MODULE. / Wang, Chi-Chuan (Inventor).
專利號: US 10,082,349 B2. 9月 25, 2018.

研究成果: Patent

TY - PAT

T1 - HEAT CONDUCTING MODULE

AU - Wang, Chi-Chuan

PY - 2018/9/25

Y1 - 2018/9/25

M3 - Patent

M1 - US 10,082,349 B2

ER -

Wang CC, 發明者. HEAT CONDUCTING MODULE. US 10,082,349 B2. 2018 9月 25.

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