Guest Editorial Special Section on the International Symposium on Circuits and Systems—ISCAS 2025

^*此作品的通信作者

研究成果: Editorial

原文	English
頁（從 - 到）	1-3
頁數	3
期刊	IEEE Transactions on Very Large Scale Integration (VLSI) Systems
卷	34
發行號	1
DOIs	https://doi.org/10.1109/TVLSI.2025.3637487
出版狀態	Published - 2026

存取文件

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title = "Guest Editorial Special Section on the International Symposium on Circuits and Systems—ISCAS 2025",

author = "Xinfei Guo and Van, \{Lan Da\} and Aatmesh Shrivastava",

year = "2026",

doi = "10.1109/TVLSI.2025.3637487",

language = "English",

volume = "34",

pages = "1--3",

journal = "IEEE Transactions on Very Large Scale Integration (VLSI) Systems",

issn = "1063-8210",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "1",

}

TY - JOUR

T1 - Guest Editorial Special Section on the International Symposium on Circuits and Systems—ISCAS 2025

AU - Guo, Xinfei

AU - Van, Lan Da

AU - Shrivastava, Aatmesh

PY - 2026

Y1 - 2026

UR - https://www.scopus.com/pages/publications/105026368950

U2 - 10.1109/TVLSI.2025.3637487

DO - 10.1109/TVLSI.2025.3637487

M3 - Editorial

AN - SCOPUS:105026368950

SN - 1063-8210

VL - 34

SP - 1

EP - 3

JO - IEEE Transactions on Very Large Scale Integration (VLSI) Systems

JF - IEEE Transactions on Very Large Scale Integration (VLSI) Systems

IS - 1

ER -