@inproceedings{69596b6f0cbc4be89f39e2d3f499a213,
title = "Glass Panel Process Integrated Low Stress Organic Dielectric RDL Structure",
abstract = "In this paper, we introduce a new organic dielectric redistributed line (RDL) fabrication method by using hybrid bonding (LTHBI) technology integrated on glass panel level process (PLP). This technology is based on creating a low-layer-count and fine-pitch RDL structure via the semi-additive process (SAP) on separated panel glass carriers. Then a higher-layer-count RDL can be subsequently assembled by using a hybrid bonding process at less than 200°C. For the novel process flow, we called it as {"}Hyper RDL{\textregistered}{"}or HRDL{\textregistered}. The utilization of low-temperature hybrid bonding for the RDL introduces a substantial reduction in accumulated stress during the process, thereby mitigating issues related to warpage.",
keywords = "HBI, Low Temperature Cu-Cu Bonding, PLP, RDL",
author = "Hsiung, {Chien Kang} and Terry Wang and Sarah Wozny and Bernt, {Marvin L.} and Chen, {Kuan Nang}",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 74th IEEE Electronic Components and Technology Conference, ECTC 2024 ; Conference date: 28-05-2024 Through 31-05-2024",
year = "2024",
doi = "10.1109/ECTC51529.2024.00320",
language = "English",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1896--1899",
booktitle = "Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024",
address = "美國",
}